Rapid Pro


Rapid Pro – First K&S Gen-S Series Automatic Wire Bonder

RAPID™ Pro introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.

Key Features:
•    Real-time Process & Performance Monitoring
•    Real-time Equipment Health Monitoring
•    Advanced Data Analytics & Traceability
•    Predictive Maintenance Monitoring & Analysis
•    Detection & Enhanced Post bond Inspection
•    Latest Response Based Processes
        - ProCu-6, ProAu-2, ProAg
        - PSP-Cu, PSP-Ag
        - ProCu Loop

Bondable Area Configurations:
•    RAPID Pro LA (Large Area)
•    RAPID Pro ELA (Extended Large Area)



Download RAPID™ Pro brochure