ICCO EMT

  • Sample production, NPI, prototyping, small batches production
  • Lead free, glue printing reflow and wave soldering processes
  • µBGA, BGA, CSP, QFP, 01005, odd placement capabilities
  • Conformal coating (dipping, curing)
  • ICT, X-ray and optical inspection
  • Burn-in test
  • Repair and rework capabilities
  • Wiring activities
  • Manual assembly, final assembly, vertical integration and customization
  • Product packing
  • Setup verification system on AX501 Pick and Place Machine (based on SVS Pro System from Assembleon)