Kulicke&Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets.

Kulicke & Soffa’s expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly.

Advanced Packaging (Flip-Chip)
 
Katalyst
 
       
Advanced Packaging (TCB)
 
Apama C2S
 
  Apama C2W
 
   
Ball Bonder
 
Rapid Pro
 
  ConnX Elite
 
   
Electronics Assembly
 
iX 502/302 iX 302
 
  iFlex
 
  Hybrid SiP
 
Wafer Level Bonder
 
ATPremier PLUS
 
       
Wedge Bonder
 
Asterion
 
  Asterion EV