Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets.
Kulicke & Soffa’s expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly.
|Advanced Packaging (Flip-Chip)
|Advanced Packaging (TCB)
||iX 502/302 iX 302
|Wafer Level Bonder