Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets.

Kulicke & Soffa’s expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly.

Advanced Packaging (Flip-Chip)
Advanced Packaging (TCB)
Apama C2S
  Apama C2W
Ball Bonder
Rapid Pro
  ConnX Elite
Electronics Assembly
iX 502/302 iX 302
  Hybrid SiP
Wafer Level Bonder
ATPremier PLUS
Wedge Bonder
  Asterion EV