The new iX has continuous enhancements in the total pick and place process, further introducing a new light weight feeding range with proven high field-measured pick-rates of over 99.99%, higher placement accuracies for passives (35 microns), new component range, 25% increased output for camera aligned components. iX continues the success of the former A-series platform – arrived by now to maturity. This platform provides unique performances in the industry, like industry’s most controlled placement process or reliability <1 DPM.
The iX 502/302 and iX 302 modules come with three or five trolley stations respectively and can be scaled in small steps to desired output capacity, without compromising placement accuracy. Next to the wide range of components from the smallest chips to large ICs, odd-form SMD components up to 10.5 mm tall can also be handled. By adding tray capability, as well as tape-, bulk- and stick feeding, a full range of feeding capabilities is supported for maximum flexibility