BTU is the global leader in thermal process equipment used for the production of electronics and electronic components. Typically these applications require high productivity and excellent process control. BTU’s reflw ovens and furnaces have been used for printed circuit board assembly, semiconductor packaging, and thick film processing.

In printed circuit board assembly, surface mount technology SMT reflow is performed by BTU’s Pyramax™ and Dynamo reflow ovens. Dynamo is an innovative reflow oven that maximizes thermal repeatability and value for consumer electronics manufacturers.  

For semiconductor packaging, BTU offers nitrogen processing using the Pyramax™ convection reflow oven and flux-free hydrogen processing using a controlled atmosphere reflow furnace for applications such as wafer bump reflow.