BTU is the global leader in convection reflow ovens and inline controlled atmosphere furnaces used for the production of electronics and electronic components.

In printed circuit board assembly, surface mount technology SMT reflow is performed by BTU’s Pyramax™ and Dynamo reflow ovens. Dynamo is an innovative reflow oven that maximizes thermal repeatability and value for consumer electronics manufacturers.  

For semiconductor packaging, BTU offers nitrogen processing using the Pyramax™ convection reflow oven and flux-free hydrogen processing using a controlled atmosphere reflow furnace for applications such as wafer bump reflow.